Packaging Technology for Automotive Power Device.

Embedded Power-An Integration Packaging Technology for IPEMs

A hybrid MCM-based 3-D integration technology for packaging intelligent power electronics modules has been developed. The bare power chips are buried in the ceramic frame with dispensed and screen printed dielectric encapsulates. This dielectric coating is designed to achieve planarization and open up the contacts of the power chips. A metallization layer, deposited and patterned on top of the ...

Validating Medical Device Packaging

A Parametric Model for Automotive Packaging and Ergonomics Design

This paper describes the capabilities of a parametric model developed to perform design and analysis tasks in the areas of advanced engineering activities during the development of a new automotive product. The model focuses on selection of vehicle parameters for exterior shape specification, positioning of occupants in the vehicle space, and interior ergonomics considerations related to reach,...

Modern Electronic Packaging Technology

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...

Semiconductor Packaging Assembly Technology

This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...